microelectronic component meaning in Chinese

微电子器件

Filed - induced charged - device model test method for electrostatic discharge withstand thresholds of microelectronic components
微电子元件静电放电容许阈的场感应带电设备模型试验方法
Dynamic loading plays a critical role in the functional performance and mechanical reliability of microelectronic components and devices
动力载荷对微电子组件和装置能否可靠工作起关键作用。
Copper wire ball bonding is a new technology which is expected to replace the traditional gold wire ball bonding and is of great significance in reducing the cost and improving the reliability of microelectronic components
铜丝球键合是一种有望取代现行金丝球键合工艺的新技术,这一技术对于降低微电子元器件的成本、提高元器件的可靠性具有重要意义。